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| this is information on a product in full production. november 2015 docid028619 rev 1 1/11 11 balf-cc25-02d3 50 ohm, conjugate match to cc2541 transformer balun datasheet ? production data features ? 2.45 ghz balun with integrated matching network ? matching optimized for following cc2541 ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? coated flip-chip on glass ? small footprint: < 0.88 mm2 benefits ? very low profile ? high rf performance ? pcb space saving versus discrete solution ? bom count reduction ? efficient manufacturability description stmicroelectronics BAL-CC25-02D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. this has been customized for the cc2541 rf transceivers. it?s a design using stmicroelectronics ipd (integrated passive device) technology on non- conductive glass substrate to optimize rf performance. figure 1. pin configuration (top view) figure 2. application schematic (top view) ) o l s & k l s s d f n d j h e x p s v $ % 6 ( * 1 ' 5 ) b 3 5 ) b 1 = www.st.com
characteristics balf-cc25-02d3 2/11 docid028619 rev 1 1 characteristics table 1. a bsolute maximum rating (limiting values) symbol parameter value unit p in input power rf in 20 dbm v esd esd ratings mil std883c (hbm: c = 100 pf, r = 1.5 , air discharge) 2000 v esd ratings machine model (mm: c = 200 pf, r = 25 , l = 500 nh) 500 esd ratings charged device model (cdm, jesd22-c101d) 500 t op operating temperature -40 to + 105 c table 2. electrical characteristics - rf performance (t amb = 25 c) symbol parameter value unit min. typ. max. z out nominal differential output impedance conjugate match to cc2541 z in nominal input impedance 50 f frequency range (bandwidth) 2379 2507 i l insertion loss in bandwidth 1.6 1.8 db r l_se single ended return loss in bandwidth 9 10 db r l_diff differential ended return loss in bandwidth 9 17 db imb phase imbalance 7 a imb amplitude imbalance 0.6 db docid028619 rev 1 3/11 balf-cc25-02d3 characteristics figure 3. balun transmission (t amb = 25 c) figure 4. insertion loss (t amb = 25 c) figure 5. return loss on se port (t amb = 25 c) g % i u h t * + ] g % i u h t * + ] g % i u h t * + ] characteristics balf-cc25-02d3 4/11 docid028619 rev 1 figure 6. return loss on diff port (t amb = 25 c) figure 7. amplitude imbalance (t amb = 25 c) figure 8. phase imbalance (t amb = 25 c) g % i u h t * + ] g % i u h t * + ] g h j i u h t * + ] docid028619 rev 1 5/11 balf-cc25-02d3 package information 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 2.1 flip-chip package information figure 9. flip-chip package outline table 3. flip-chip package mechanical data parameter description min. typ. max. unit a bump height + substrate thickness 0.570 0.630 0.690 mm a1 bump height 0.155 0.205 0.255 mm a2 substrate thickness 0.400 mm b bump diameter 0.215 0.255 0.295 mm d y dimension of the die 0.890 0.940 0.990 mm d1 y pitch 0.500 mm e x dimension of the die 0.890 0.940 0.990 mm e1 x pitch 0.500 mm se 0.250 mm fd distance from bump to edge of die on y axis 0.220 mm fe distance from bump to edge of die on x axis 0.220 mm ccc 0.05 mm $0.025mm $ $ % r w w r p y l h z v l g h y l h z i ' ' ( 7 r s y l h z ' $ f f f ' & & i ( 6 ( ( $ $ % ? e % package information balf-cc25-02d3 6/11 docid028619 rev 1 figure 10. footprint figure 11. bump coordinates (top view) p p p p p p " # 6 ( * 1 ' 5 ) b 3 5 ) b 1 & r r u g l q d w h v j l y h q i u r p f h q w h u r i g l h l q ? p 6 ( * 1 ' ' , ) ) 3 ' , ) ) 0 docid028619 rev 1 7/11 balf-cc25-02d3 package information figure 12. footprint - 3 mils stencil -non solder mask defined figure 13. footprint - 3 mils stencil - solder mask defined & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g figure 14. footprint - 5 mils stencil -non solder mask defined figure 15. footprint - 5 mils stencil - solder mask defined g h s h q g l q j r q s d v w h l w f d q j r g r z q w r ? p & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g g h s h q g l q j r q s d v w h l w f d q j r g r z q w r ? p & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g package information balf-cc25-02d3 8/11 docid028619 rev 1 figure 16. pcb layout recommendation figure 17. marking note: more information is available in the stmicroelectronics application note: an2348 flip-chip: ?package description and recommendations for use? x y x w z w dot, st logo ecopack grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) docid028619 rev 1 9/11 balf-cc25-02d3 package information figure 18. flip chip tape and reel specifications note: more information is available in the application note: an2348: ?flip chip: package description and recommendations for use? dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 0.1 2.0 0.05 2.0 0.05 8.0 0.3 1.75 0.1 3.5 0.05 ? 1.55 0.10 0.73 0.05 1.0 0.05 0.20 0.015 1.0 0.05 st st st x x z y w w x x z y w w x x z y w w st st st st x x z y w w x x z y w w x x z y w w x x z y w w ordering information balf-cc25-02d3 10/11 docid028619 rev 1 3 ordering information 4 revision history table 4. ordering information order code marking package weight base qty delivery mode BAL-CC25-02D3 te flip chip 1.07 mg 5000 tape and reel (7?) table 5. document revision history date revision changes 17-nov-2015 1 initial release docid028619 rev 1 11/11 balf-cc25-02d3 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2015 stmicroelectronics ? all rights reserved |
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